The Bal Spring® canted coil spring is a 3-in-1 solution to mechanical connecting, electrical conducting and EMI/RFI shielding challenges in equipment used for semiconductor fabrication and testing.
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More Connections in Less Space for Neuro Devices
Designing smaller implantable neuromodulation devices with greater connector density is one tough job. But choosing the right electrical contact...
Benefits of the Spring
When designing orthopedic and medical devices, engineers invariably encounter the same basic challenge: they need to connect two...
Next-Generation IPGs Integrate Connector System Components
Systemization reduces time to market. For years, manufacturers of neurostimulators and other active implantables have been feeling extraordinary...
Designing For Improved Signal Integrity in Downhole Tools
Designing a tool that consistently delivers great signal integrity and accurate data in harsh downhole conditions is one...
SWaP-ready Springs Help Designers Advance Connector Performance
The multi-function Bal Spring® canted coil spring can help you address tough size, weight and power consumption challenges...
Designing For Improved Semicon Equipment Performance
Designing For Improved Semicon Equipment Performance from BSEmarketing Designing semiconductor equipment that maintains high levels of precision, speed, and...
Reducing Risk: Validated Methods for Cleaning Orthopedic Devices that Use Canted Coil Springs
Orthopedic devices that contain canted coil springs can be cleaned by methods that meet FDA requirements. Two such validated...
Contact Design for Neuromodulation Devices
The Bal Conn® electrical contact helps device makers around the world feel confident about their choice of lead interface...
