For over two decades, we have been collaborating with medical device manufacturers to develop and deliver high-quality, high-performance connecting and conducting solutions. Built around proven Bal Spring® canted coil spring technology, our products currently ensure reliable connections in more than a million implantable devices worldwide. Our continuous research and development efforts are yielding new solutions that consistently enhance design and performance of electrical connections in existing and emerging therapies, including cardiac healthcare, neurostimulation and implantable-sensing, among others.
Cardiac healthcare management applications demand uncompromising performance, and Bal Conn® electrical contacts deliver. Their superior dynamic resistance stabilization properties meet or exceed IS-1 and IS-4 requirements, and their compact design helps engineers make devices smaller and lighter. Typical Bal Conn applications for cardiac healthcare management include defibrillation, pacing and resynchronization.
With their compact design and dynamic resistance stabilization properties that meet or exceed neurostimulation device requirements, our Bal Conn® products are the ideal solution for connecting applications in neurostimulation therapies. They provide reliable performance and help advance device design for spinal stimulation, deep brain stimulation (DBS) and vagus nerve stimulation.
In devices that monitor and sense physiological functions, Bal Conn® electrical contacts provide unparalleled conductivity and reliability. Their physical properties and compact design make them ideal for use in a range of sensing applications, including nerve function, brain activity and blood pressure.
In cardiac management, neurostimulation and implantable sensing, our SYGNUS® implantable contact system combines proven electrical contact technology and silicone isolation seals in a dense, pre-tested configurable stack that helps device makers reduce overall package size and accelerate development. SYGNUS is the world's first integrated seal and electrical contact system and is engineered to help OEMs accelerate the development process. The densely spaced contact stack can accommodate leads with diameters ranging from 0.90 to 3.20 mm.